请将下列内容翻译: Tranditional IC packaging materials are plastic packaging and ceramic packaging. Plastic packaging uses an epoxy polymer to encapsulate the wirebonded die and leadframe. This technology has many different types of plastic packages. Ceramic packaging is used for state-of-the-art IC packages that require either maximum reliability or high-power. The two main types of ceramic packaging are either a refractory (high temperature) ceramic, or ceramic DIP (CERDIP) technology. Both have a hermetic seal (sealed against moisture).